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100V TOLL Package MOSFET
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Introduction MOSFET application power is more and more large, reduce the MOSFET conduction internal resistance, improve the heat dissipation performance of MOSFET, reduce the volume, improve the power density of MOSFET, MOSFET practitioners tireless pursuit. The Yangjie Technology To-Leadless (TOLL)MOSFET package is optimized TO handle currents up to 280A, increasing power density while dramatically reducing space footprint. Compared with the D2PAK, the occupied space is reduced by 30% and the height is reduced by 50%, resulting in a total space saving of nearly 60%, making the board design more compact.
Features 1. The maximum current capacity is 280A, and fewer parallel and heat dissipation components are required; 2. The welding area is improved, which significantly reduces the electromigration phenomenon and high system reliability; 3. Very low encapsulation parasitic effect, low EMI; 4. No pin package, support extremely compact design; 5 using TOLL packaging, better calorific value characteristics.
SPECIFICATION
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