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Introduction 1.Ultra-thin package, can be applied to miniaturized, thin circuit;
2.The underside of the package has a heat sink, heat dissipation performance is excellent;
3. It uses environmentally friendly materials, in line with RoHS standards;
4. Widely used in secondary rectifier circuit, converter, continuous current diode, AC/DC power supply protection;
Features 1.Excellent heat dissipation performance: the back Pad area is large, compared with the change of SOD-123FL heat dissipation path, the original pin heat dissipation is changed to the back metal plate Pad heat dissipation, the metal heat dissipation area is increased by 89%.
2. Small package shape: compared with SOD-123HE package length is reduced by 56%, the width is reduced by 56%, meeting the development trend of package miniaturization.
SPECIFICATION

SMHE SERIES

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